Most ESD managers in the electronics industry understand the serious threat of electrostatic discharge to the integrity of electronic components during manufacturing, shipping, and storage. However, many do not realize that it is possible to get corrosion protection at the same time by combining ESD with VCI (Vapor Corrosion Inhibitor) film and bag technology. Furthermore, these two benefits are available in the form of self-seal bubble bags now available through Cortec® Advanced Films in Cambridge, Minnesota.

EcoSonic® ESD Self-Seal Bubble Bags

EcoSonic® ESD Self-Seal Bubble Bags powered by Nano VpCI® combine Vapor phase Corrosion Inhibitors with self-seal cushioning bubble bags and ESD protection to safeguard sensitive electronics from three threats: triboelectric charge generation, corrosion, and physical damage. In addition to standard ESD protection that is typically a must-have in the electronics industry, EcoSonic® ESD Self-Seal Bubble Bags provide corrosion protection to metal components by saturating the enclosed airspace with Vapor phase Corrosion Inhibitors. These form a protective molecular layer on all packaged metals without leaving behind a noticeable film or residue. Finally, the bubbles serve as cushioning, dunnage, and void fill material.

Why Combine Corrosion Protection with ESD Packaging?

But why add corrosion and ESD protection to a bubble bag? The answer is that electronics are highly complex, sensitive components that may contain multiple metal types in one unit. Quality standards are high, and any discoloration—let alone corrosion—on a component may cause the end user to reject it due to the possibility of failure. In a dry environment, there would be little to no concern. However, when electronics must be shipped cross-country or exported around the world, they encounter unpredictable and extreme environments of fluctuating temperatures and humidity that could easily cause condensation and corrosion within the electronics package. Good storage options can also be expensive and difficult to find in hot and humid climates where it is not uncommon for large computer companies to require climate-controlled warehousing for electronics. Combining corrosion protection with ESD packaging and bubble wrap tackles three threats at once for greater convenience and efficiency in electronics packaging.

How to Use EcoSonic® ESD Self-Seal Bubble Bags

EcoSonic® ESD Self-Seal Bubble Bags are easy to use. Simply place the item in the bag, peel off the white strip, and fold the top of the bag over to seal. Metals protected include:
  • Carbon steel
  • Aluminum
  • Copper
  • Silver
  • Brass
  • Stainless steel
The corrosion inhibitors in EcoSonic® ESD Self-Seal Bubble Bags have no adverse effects on plastic (lexan), optics, elastomers, and other non-metallics. They also create no interference with subsequent processing (i.e., welding, cleaning, soldering). After the bag has been used, it can be recycled at facilities that accept #4 recyclable products. Electronic components that may benefit from the ESD and corrosion protection of EcoSonic® ESD Self-Seal Bubble Bags with cushioning include the following:
  • Hard drives
  • Processors
  • Video graphics cards/boards
  • Memory sticks/modules
  • Networking cards/boards
  • Other circuit boards

Choose a Convenient Packaging Solution and Be Done!

ESD managers or electronics packaging engineers looking for new options should be sure to consider EcoSonic® ESD Self-Seal Bubble Bags for a quick packaging solution. With these, protection against triboelectric charge, corrosion, and low degrees of physical impact is as easy as slipping the part inside the bag, sealing it, and being done! Contact Cortec® to learn more about EcoSonic® ESD Self-Seal Bubble Bags, which are also available in a non-ESD version: Keywords: ESD bags, ESD protection, Cortec, electrostatic discharge, VCI film and bags, ESD bubble bags, corrosion protection, electronics industry, corrosion inhibitors, electronics packaging Need a High-Resolution Photo?  Please Visit: For a PDF version please click here.



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